Tela closes $5.5M to scale semiconductor manufacturing
Tela Innovations, a Campbell, Calif. firm working to streamline semiconductor designs and manufacturing, has added three investors to close a $5.5 million third round of funding, reports VentureWire. The new backers, Cadence Design Systems, KT Venture Group and Qualcomm, join past contributors Intel Capital, AsiaTech Management, Sand Hill Finance, Teton Capital Group and Western Technology Investment.
The company plans to use the money to commercialize its semiconductor designs, aimed at efficiently scaling their processes.
Next Story: Konarka powers up with $45M for solar “plastic”
Previous Story: BeliefNetworks lassoes funds for semantic intelligence
About the Author, Camille Ricketts
Camille is the lead writer for GreenBeat. She came to VentureBeat from Google where she worked on its traditional platforms team, particularly in TV. Before that, she was a reporter for the Wall Street Journal in New York and London. Follow her on Twitter at @camillericketts, and follow VentureBeat on Twitter at @venturebeat.
With GreenBeat 2009, VentureBeat's all-star conference on all things Smart Grid, coming up in November, Camille will be expanding coverage of this exciting space. Stay up to date by following @greenbeat2009 on Twitter or by becoming a fan of the event on Facebook here.